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Known Good Die
PB6800
SiC KGD Die Handler

Nexustest PB6800 is a high-end SiC KGD Die Handler widely used in the semiconductor industry. It focuses on dynamic and static parameter testing of bare die-level SiC power chips. The system features a modular design and supports various chip incoming methods such as frame ring, tape and reel, and tray. It enables hard docking connection and multi-stations normal or high temperature test, and has a along with high voltage arching protection function. 

Highlights
  • Excellent scalability
    Modular design accommodates loading, unloading
    and multiple test stations for enhanced versatility
  • Dynamic, static and UIS tests
    Static test 2000V/600A
    Dynamic test 1200V/2000A
  • Unloading modular design
    Support wafer/wafer + tape&reel/ wafer + auto tray
  • Precision temperature control
    Maintain room temperature to 200°C with ±3°C accuracy and 0.1°C resolution
  • Airtight socket design
    Prevent arcing with nitrogen gas protection and integrated pressure monitoring
  • High-efficiency multi-site testing
    Up to six test sites deliver 4000+ UPH with 0.7s test times
  • Easy maintainability
    Support automatic socket replacement for blown die, enhancing runtime

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