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Excellent scalabilityModular design accommodates loading, unloading
and multiple test stations for enhanced versatility -
Dynamic, static and UIS testsStatic test 2000V/600A
Dynamic test 1200V/2000A -
Unloading modular designSupport wafer/wafer + tape&reel/ wafer + auto tray
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Precision temperature controlMaintain room temperature to 200°C with ±3°C accuracy and 0.1°C resolution
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Airtight socket designPrevent arcing with nitrogen gas protection and integrated pressure monitoring
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High-efficiency multi-site testingUp to six test sites deliver 4000+ UPH with 0.7s test times
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Easy maintainabilitySupport automatic socket replacement for blown die, enhancing runtime