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Laser Diode Burn-in
BI6203
CoC Burn-In System

The BI6203 burn-in system is a high-density, multi-functional testing system specifically designed for the verification of the burn-in lifespan of semiconductor laser chips.

The system adopts a modular design with large single-layer structure. Integrating multi-channel power supplies, temperature controllers, real-time data acquisition capabilities. Standardized drawers and flexible fixture are suitable for various sizes of CoC (Chip on Carrier). The fixtures can be easily replaced to accommodate different device types. Drawers could be replaced when new test functions are added, such as thermistor monitoring and power monitoring.

Highlights
  • Driving power supply
    Supports up to 4224 channels of 4-quadrant SMU driving power
  • Strong thermal conductivity
    Temperature deviation ＜ ±1℃ for the overall thermal sink（40～100℃）
  • Temperature control
    Each fixture has independent heating, temperature control, monitoring, over temperature protection and heat dissipation units for energy saving.
  • Fixture
    Fishbone-type fixture which support wire bonding on it
  • Safety and reliability
    Comprehensive protection mechanisms through hardware and software eliminate potential issues such as EOS
  • Online power monitoring
    Optional configuration for online power monitoring, supporting complete LIV or EA scans, with the ability to analyze Ith.
    The test repeatability deviation ＜±1%
  • 4224 CoC simultaneously burn-in
    Production capacity flexibly configured based on customer requirements
  • Software functions
    All test results, test statuses, and abnormal conditions are recorded in the database which could be stored and traced efficiently
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