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Semiconductor Reliability
PLR0010
Package Level Reliability Test Equipment
The Nexustest PLR0010 Package Level Reliability Test Equipment is a reliability test system developed based on the JEDEC reliability test standards. It is mainly used for testing functions such as TDDB (Time-Dependent Dielectric Breakdown), HCI (Hot Carrier Injection), BTI (Bias Temperature Instability). The test system can reach temperatures up to 250℃ and utilizes algorithm models to analyze data, enabling the analysis of process defects. Each channel of the system is equipped with independent overcurrent protection to ensure the safety of the devices under test (DUT). Additionally, it can interface with the customer's EAP system for production data management, facilitating in-depth performance analysis and quality control.
Highlights
  • Multiple test modes
    TDDB/HCI/BTI/GOI
  • Micro oven architecture
    4 independent ovens
  • High temperature testing
    Up to 250°C
    Temperature uniformity of ±1%°C
  • High parallel testing
    Simultaneous testing of 960 DUTs
  • Support On-the-fly
    Switch to monitor ＜ 220 μs
  • Self-developed SMU
    Autorange make sure high accuracy
  • Flexible API interfaces
    Flexible API and easy to use
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