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Known Good Die
PB6400
SiC KGD Die Handler
The Nexustest PB6600 SiC KGD Die Handler is primarily used for die-level dynamic and static testing of power chips, implementing performance parameter screening to improve the yield rate of the packaged modules. The test items, conditions, and parameters can be configured according to the customer requirements. The system supports various die loading including blue tape, waffle pack, and tape & reel.
Highlights
  • High flexibility design
    Isolated handler and test stations design offers strong expandability
  • Multiple parallel test
    Maximum of 4 test stations are supported, and the different test station support different test conditions and items
  • Support dynamic and static parameter test
    Up to 2000V/300A static test, 2000V/1200A dynamic test
  • Multi-sites parallel test
    Supports maximum 4 test stations with independent test conditions and parameters
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