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Known Good Die
PB6400
SiC KGD Die Handler
Nexustest PB6400 KGD Die Handler can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports a variety of chip packaging methods, such as blue tap, Waffle Pack and Tape &Reel.
Highlights
  • Excellent scalability
    Modular design with loading, unloading and test stations
  • Dynamic, static and UIS tests
    Static test 2000V/200A
    Dynamic test 2000V/1500A
  • Multi-site parallel testing
    Supports up to four independent test sites, each configurable with unique test conditions and parameters
  • Precision temperature control
    Room temperature ~ 185 ℃, accuracy＜±3°C,resolution: 0.1°C
  • Airtight socket design
    Supports nitrogen gas for arcing protection with integrated pressure monitoring
  • 6s AOI
    Micro-scale visible defect inspection down to 12µm
  • High throughput
    Up to 900 UPH @ 1s test time for Known Good Die
  • Powerful software
    Supports data MAP and bin sorting Enables local storage, database uploads, and EAP integration Offers tiered permissions and multi-account management

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