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Wafer Level Reliability
PLR0010
Package Level Reliability Test Equipment
The Nexustest Instruments PLR0010 package level reliability test equipment is a reliability test system developed based on the JEDEC reliability test standards. It is mainly used for testing functions such as TDDB (Time-Dependent Dielectric Breakdown), HCI (Hot Carrier Injection), NBTI (Negative Bias Temperature Instability), and EM (Electromigration). The test system can reach temperatures up to 250℃ and utilizes algorithm models to analyze data, enabling the analysis of process defects. Each channel of the system is equipped with independent overcurrent protection to ensure the safety of the devices under test (DUT). Additionally, it can interface with the customer's EAP system for production data management, facilitating in-depth performance analysis and quality control.
Highlights
  • Multi-test mode
    Supports TDDB/HCI/NBTI/EM test modes；Compliant with JEDEC device reliability testing standards
  • Using the Micro Oven architecture
    High temperatures up to four zones，Each oven can independently control temperature up to 250°C
  • High number of concurrent measurements
    Capable of testing up to 960 DUTs simultaneously
  • Supports high voltage testing
    Power supply can support up to 3500V
  • Support On-the-fly
    Supports on-the-fly testing and data analysis
  • Self-developed software testing platform
    Using Nexustest PLR software test platform, the test curve can be presented in real time, and the data output format can be customized according to user needs.
  • Self-developed SMU
    Adopt Nexustest high-precision source meter
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