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Wafer Level Burn-In
WLBI370A
Wafer Level Burn-In System
WLBI370A applies to the screening of product reliability and quality monitoring of batch production. The whole system is designed to conduct single HTGB burn-in on 20 wafers, achieve automatic feeding/unloading and BI condition switching, and conduct Vth testing for each product. It meets different cost requirements based on various configuration needs, as well as the demands of customers for configurable R&D applications and high-capacity production. BI time can be configured as required, and the tested chip of each channel has separate over-current protection. MAP data is available for analysis.
Highlights
  • Support SiC wafer product burn-in
    Compatible with SiC wafers of 6&8 inches
  • Multiple test functions
    Support parameter test Igss、Vth.
    Support online editing and testing of Recipe and SPE
  • Fully automatic burn-in syetem
    Support 1500 channels/layer simultaneous burn-in
    Support up to 50PCS wafer cassette（20pcs wafer simultaneous burn-in）
  • Fully automated integration
    Wafer jam loading is fully automated and integrated
    Support stitch repeatability positioning accuracy ±25um
  • High temperature resistant design
    Drawer heating is designed to withstand 180°C
  • The minimum current measurement resolution can reach 0.1 nA
    Accurate measurement of leakage current
  • Precise temperature control
    Uniformity ±1.5℃, accuracy＜1℃, resolution 0.1℃
  • Product anomaly protection funtion
    The system hardware overcurrent protection supports nitrogen protection to prevent PAD oxidation
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