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Wafer Level Burn-In
WLBI370A
Wafer Level Burn-In System
The WLBI370A Wafer Level Burn-in System is a fully automated SiC wafer burn-in testing solution. It offers ultra-high burn-in capacity, capable of performing High-Temperature Gate Bias (HTGB) burn-in on up to 20 wafers simultaneously. Burn-in conditions can be configured to meet the requirements of different products. The system enables precise threshold voltage (Vth) testing for each die and features independent overcurrent protection on each channel to ensure device safety. It supports integration with customer EAP systems for production data management and automatically generates MAP data for detailed performance analysis and quality control.
Highlights
  • Fully automated system
    Automated wafer and fixture loading/unloading without manual intervention
  • High throughput
    Supports simultaneous HTGB burn-in of up to 20 wafers at full capacity
  • High compatibility
    Easy switching between 6-inch and 8-inch wafers by replacing fixtures
  • Independent temperature control
    Each drawer is equipped with independent temperature control and power systems, ensuring precise and stable burn-in conditions for each wafer
  • Multi-channel testing
    Supports up to 1,500 channels per layer for burn-in
    Burn-in channel capacity can be expanded via second touchdown
  • High-precision testing
    0.1nA leakage current resolution
  • Wide temperature range
    Temperature control ranges from 40°C to 175°C
  • Comprehensive system features
    Real-time monitoring of Igss and Vth testing
    Robust hardware protection against overcurrent and overvoltage
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