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Laser Diode Test
CT8201
RT & HT Die tester
Nexustest RT & HT Die tester CT8201 is for LIV scanning test, EA scanning test and spectral scanning test of photoelectric characteristics of semiconductor DFB or EML laser at two different temperatures of normal temperature and high temperature. The system is mainly composed of six parts: wafer supply area, chip handling area, chip position correction area, chip OCR extraction area, chip testing area, and chip storage area. The system integrates wafer ring loading, transportation, DUT ID scanning, normal/high temperature testing, unloading, and sorting.
CT8201 supports laser forward and backward photoelectric test and forward light spectrum test. Support two temperature zone tests: two test platforms to support high temperature/normal temperature test.
The test efficiency of CT8201 is very high, and the above 6 processes can be completed within 6s (EML laser efficiency will increase according to different test items). Ideal for high volume production applications. The system adopts eccentric cam structure, high-precision linear motor, high-repeatability stepper motor gauge, high-precision fixture, high-stability power-on probe and high-thermal-conductivity stage, making it ultra-high precision and stability.
Highlights
  • Fully automated and intelligent integrated solutions
    Highly integrated and fully automated solution covering very complex testing processes
  • High efficiency
    Improve efficiency and reduce potential risks of human involvement
    Automatic switching of collimated fibers and large area photodetectors
    Automatic sorting of DUTs after testing
  • Maintenance and upgrades are very simple
    All mechanical parts can be returned to the factory independently
  • Easy to use
    Automatic alarm status and prompt display,
    All instruments, test plans, pass/fail criteria are easily configurable
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