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Wafer Level Reliability
WLR0010
Multi-site Wafer Level Reliability Test Equipment
The Nexustest WLR0010 Multi-site Wafer Level Reliability (WLR) Test System is a reliability testing system developed based on JEDEC reliability test standards. The system mainly consists of a tester and a prober station. It can perform tests such as TDDB (Time-Dependent Dielectric Breakdown), HCI (Hot Carrier Injection), and NBTI (Negative Bias Temperature Instability). The testing system can operate at temperatures up to 200°C. Additionally, it employs algorithm models to analyze data, enabling the analysis of defects in the manufacturing process. Each channel of the system is equipped with independent overcurrent protection to ensure the safety of the devices under test.
Highlights
  • Custom semi-automatic probe station
    Supports 4~12-inch wafers
  • Multi-site testing capability
    Simultaneously tests up to 16 sites
  • Nitrogen protection
    Platform unification Prevents wafer oxidation (non-pressurized)
  • Real-time curve display
    Real-time wafer map and test curve display
  • Nexustest WLR software platform
    TDDB, HCI, NBTI, HTGB, Vth, and other reliability test modes
  • Self-developed SMU
    Utilizes the Semight high-precision SMU
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