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Visual Inspection and Sorting
AL6200
Die Inspection Sorting System
Nexustest AL6200 Die Sorting system is mainly used in power chip die level visual inspection and sorting. The sorting condition is according to the different test specification and visual inspection. AL6200 supports up to 8pcs different classifications, and finish the six sides visual inspection before the sorting. The system supports frame ring input and tape reel output(tray is optional).
Highlights
  • Automatic Expansion
    Allows for automatic expansion of UV/blue tape frames, enabling normal production of non-expansion frames
  • Code Scanning
    Scan QR codes/barcodes to accurately record wafer information, including Lot ID, wafer ID, and tape ID
  • Date Map Function
    Rovides visual access to comprehensive mapping information
  • Rotational Feeding System
    Enables 360° rotation of wafers as required
  • Tape Width
    Supports a wide range of tape widths, ranging from 8mm to 24mm (typically 12mm)
  • UPH Capability
    Achieves a minimum throughput of 2,000 units per hour (UPH)
  • Six-Side Chip Inspection
    Supports thorough chip inspection on all six sides, with a maximum defect accuracy of 10μm
  • Powerful Software
    Facilitates single-chip traceability, seamless data upload, MES integration, and multi-account management with three-level rights control
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