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Wafer Level Reliability
WLR0200
Single-site Wafer Level Reliability Test Equipment
The WLR0200 Single-site Wafer Level Reliability Test Equipment is a reliability test equipment designed and developed based on the JEDEC reliability test standard, which mainly consists of a tester and a probe table, and it can realize the test of TDDB/ HCI/ BTI/ NBTI/ QBD/ AC BTI/ CV/ Vth and other functions.
Highlights
  • High temperature
    Probe station temperature reaches 300°C
  • Supports 4~12-inch wafers
    Using MPI customized high-temperature semi-automatic probe stations
  • High testing frequencyup to 1MHz
    Using high-precision and high-frequency capacitance testing instruments
  • Self-developed Technology
    Testing source uses high-precision SMU independently developed by Nexustest
  • Multiple measurement modes
    Supports TDDB/HCI/NBTI/EM test modes
  • Real-time curve display
    Real-time wafer map and test curve display
  • Nitrogen Protection
    Platform unification prevents wafer oxidation (non-pressurized)
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