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Wafer Level Burn-In
WLR3500
Wafer Level Burn-In System
WLR3500 is a high-end professional silicon carbide wafer aging testing device capable of simultaneously performing high-temperature gate bias (HTGB) and high-temperature reverse bias (HTRB) aging on six wafers. The aging test duration is highly flexible, ranging from several minutes to tens of hours, and can even be extended to thousands of hours, meeting the aging requirements of various products. It supports setting aging conditions and can accurately detect the threshold voltage (Vth) of each die. Each channel of the system is equipped with independent overcurrent protection to ensure the safety of the devices under test. The system can generate mapping analysis data (Map data) to facilitate in-depth performance analysis and quality control. This system provides flexible configurable options for research and development applications and is also suitable for high-capacity production applications.
Highlights
  • Automatic Burn-In Switching
    Support the automatic switching of GB and RB burn-in for up to six wafers simultaneously.
  • Independent Temperature Control and Power Supply
    Each drawer is equipped with its own temperature control and power supply system.
  • Wide Voltage Range
    Support HTGB voltage of ±70V and HTRB voltage of less than 2000V.
  • Multi-Channel Support
    The entire system supports up to 4320 channels (720*6), achieving high parallelism in burn-in testing.
  • High-Precision Testing
    During the burn-in process, the system offers a leakage current resolution of up to 0.1nA.
  • Arching Protection
    A high-reliability gas protection system with ~3 bar atmospheric pressure is provided, effectively preventing oxidation and arcing during the burn-in process.
  • Real-Time Monitoring and Testing
    Support real-time monitoring of key parameters such as Igss, Idss and also supports Vth testing.
  • Wide Temperature Range
    The temperature control range extends from 40°C to 175°C.
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