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Known Good Die
PB6600
SiC KGD Die Handler
Nexustest PB6600 is a high-end SiC KGD Die Handler widely used in the semiconductor industry. It focuses on dynamic and static parameter testing of bare die-level SiC power chips. The system features a modular design and supports various chip incoming methods such as frame ring, tape and reel, and tray. It enables hard docking connection and multi-stations normal or high temperature test, and has a along with high voltage arching protection function. The test probe pogo-pin is professionally designed, allowing for a large flow capacity, controllable probe marks and ensuring high test stability. The system also includes functions for unloading and bin sorting with customized selection of bin sorting methods.
Highlights
  • Excellent scalability
    Modular design with loading, unloading and test stations
  • Dynamic, static and UIS tests
    Static test 2000V/600A
    Dynamic test 1200V/2000A
  • Hard docking design
    Stray inductance of the dynamic test system≤50nH
  • Six parallel test sites
    Up to 6 sites for diverse test conditions
  • Precision temperature control
    Room temperature ~ 200 ℃, accuracy＜±3°C, resolution: 0.1°C
  • Airtight socket design
    Supports nitrogen gas for arcing protection with integrated pressure monitoring
  • High throughput
    Up to 1,400 UPH @ 1s test time for Known Good Die
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