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Known Good Die
PB6600
SiC KGD Die Handler
The Nexustest PB6600 SiC KGD Die Handler is primarily used for die-level dynamic and static testing of power chips, implementing performance parameter screening to improve the yield rate of the packaged modules. Custom development can be supported according to customer requirements.
Highlights
  • Excellent scalability
    Modular design with loading, unloading and test stations
  • Six sites parallel tests
    Supports up to 6 test stations with independent test conditions and parameters
  • Dynamic and static test
    Static test 2000V/600A
    Dynamic test 1200V/2000A
  • High accuracy results
    Room temperature ~ 200 ℃,
    accuracy<±3°C,resolution:0.1°C
  • Hard docking
    Stray inductance of the dynamic test system≤50nH
  • Nitrogen protection
    Probe card features a sealed chamber design for arcing protection.
  • UPH capability >1400pcs
    Single test station test time≤1s

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