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Wafer Level Burn-In
WLBI3800
Wafer Level Burn-in System
The WLBI3800 Wafer Level Burn-in System is a high-end, specialized SiC wafer burn-in testing solution capable of performing High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) burn-in on up to 3 wafers simultaneously. It supports a wide range of burn-in durations, from a few minutes to several hours, and can extend to thousands of hours, meeting the burn-in requirements of various products. The system integrates an automated loading and unloading system with a dual-cassette design for seamless switching. It features automatic adjustment of burn-in conditions and precise threshold voltage (Vth) measurement for each die. Each channel is equipped with independent overcurrent protection to ensure the safety of the devices under test. Additionally, the system generates Map data for detailed performance analysis and quality control. It provides stable and reliable burn-in testing support for mass production and flexible configuration options for R&D applications.
Highlights
  • Automated loading and unloading
    Fully automated wafer handling minimizes manual intervention, boosting efficiency and accuracy
  • Precise probing
    Delivers ±25μm probe mark repositioning accuracy for reliable testing
  • Comprehensive system features
    Supports map data binding for traceability and testing up to 2112 dies simultaneously
  • Multimode burn-in
    Automatically switches between HTGB and HTRB modes
  • Leakage current monitoring
    Igss and Idss leakage current moitoring
  • Integrated testing functions
    Includes Vth parameter testing for in-depth analysis
  • Exceptional measurement accuracy
    Offers maximum resolution of 0.1nA
  • Precise temperature control
    Ensures uniformity within ±3℃, accuracy within 1℃, and resolution of 0.1℃

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