Highlights
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Automated loading and unloadingFully automated wafer handling minimizes manual intervention, boosting efficiency and accuracy
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Precise probingDelivers ±25μm probe mark repositioning accuracy for reliable testing
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Comprehensive system featuresSupports map data binding for traceability and testing up to 2112 dies simultaneously
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Multimode burn-inAutomatically switches between HTGB and HTRB modes
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Leakage current monitoringIgss and Idss leakage current moitoring
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Integrated testing functionsIncludes Vth parameter testing for in-depth analysis
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Exceptional measurement accuracyOffers maximum resolution of 0.1nA
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Precise temperature controlEnsures uniformity within ±3℃, accuracy within 1℃, and resolution of 0.1℃
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