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Wafer Level Burn-In
WLBI3800
Wafer level Burn-In System
WLBI3800 system is designed to perform HTGB and HTRB burn-in of three wafers at a time, with automatic wafer loading and unloading.The double cassette design without any cassette replacement time, automatic switching of aging conditions, and Vth testing of each product.It can meet different cost requirements according to different configuration requirements, and provide customers with configurable R & D applications and mass production applications. The aging duration can be from a few minutes to tens of hours, or even thousands of hours, and each channel has a separate over-current protection to the device circuit under test. MAP data can be provided for analysis.
Highlights
  • Compatible with 2,3,4,6,8 inch wafers
    HTGB and HTRB are integrated in one drawer
  • Support parameter test Idss, Igss, Vth
    Support MAP data binding, data traceability
  • Support simultaneous burn-in of 3PCS wafers
    Support up to 2112 channels burn-in per wafer (number of channels configurable)
  • Support automatic loading/unloading wafer with cassette
    Support double jam design, can be seamless burn-in
  • High-precision leakage current test
    The highest accuracy leakage current resolution can reach 0.1nA
  • Support needle-mark repeated position
    Accuracy ± 25um
  • Support nitrogen protection
    Prevent high-pressure arc and pad oxidation
  • High temperature resistant design, temperature control accuracy
    Drawer heating related to 200 degrees resistant design, maximum long-term working temperature of 175 degrees
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